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Hybrid memory cube interface specification has been finalised
Hybrid memory cube interface specification has been finalised
At a meeting of 100 members of the Hybrid Memory Cube Consortium (HMCC) the specifications for the new faster 3D memory have been finalised. This is a “much anticipated, disruptive memory computing solution” which will allow manufacturers to start producing hardware that offers approximately 15 times the throughput of today’s DDR3 RAM.
Read more at HEXUS
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